基本情况

出生年月：1989.5

职称：副教授

最高学位：博士

主要研究方向：功率电子封装材料、工艺、可靠性研究；特种陶瓷涂层；先进表征测试技术

导师类别：学术型硕导、专业型硕导

工作单位：材料科学与工程学院材料成型加工系

Email: l.liu@whut.edu.cn

网站：https://www.researchgate.net/profile/Li-Liu-83

教育及工作经历

2016.10-至今     武汉理工大学，材料科学与工程学院，材料成型加工系，讲师/副教授

2014.01-2014.12  英国拉夫堡大学，机械电子制造工程学院，研究助理

2012.10-2016.10  英国拉夫堡大学，机械电子制造工程学院，工学博士

奖励情况

2022，国家大学生创新创业训练计划项目，国家级，优秀结题，指导教师

近期主持科研项目

1. 2021-2023，面向电力电子器件的低温低压高强度芯片连接技术研究，国家自然科学基金青年基金项目。

2. 2024-2025，高功率大面积IGBT芯片的高强度低温低压互连技术及机理研究，武汉市知识创新专项曙光计划。

3. 2023-2024，基于电磁压制Cu@Ag复合焊片的低温互连机理研究，哈尔滨工业大学先进焊接与连接国家重点实验室开放基金。

4. 2023-2024，典型电子封装结构的力学可靠性研究，企业委托。

近期代表性学术成果

学术论文：

1. Liu Z., Liu S., Zhang Z., Chen Z.*, Wang Z., Liu L.* Low-temperature joining of alumina ceramics and nickel by Al-Ni self-propagating nanofoil. Ceramics International, 2023, 49 (22), 36103-36113.

2. Liu L., Huang W., Chen Z*. Effects of temperatures on microstructure evolution and deformation behavior of Fe-32Ni by in-situ EBSD. Materials Science and Engineering: A, 2023, 875 (6), 145097.

3. Zhao W.*, Yao C., Pan L., Li Z., Liu Q, Liu L.* Hofmeister effect induced advancement of the dydrogels by 3D printing. Polymer. 2023, 282, 126151.

4. Liu L., Luo Z., Zhao B., Li Z., Zhang C., Chen Z., Jiang J., Deng L., Cao X.*, Chen Z.* Effects of Gd doping on microwave absorption properties and mechanism for CaMnO3 perovskites. Ceramics International. 2023, 49(14, part A), 23499-23509.

5. Liu L., Shi R., Zhang S., Liu W., Huang S., Chen Z*. Effects of Ag shell on electrical, thermal and mechanical properties of Cu@Ag composite solder preforms by electromagnetic compaction for power electronics. Materials Characterization. 2023, 197, 112702.

6. Xu Z.#, Liu X.#, Li J.*, Sun R., Liu L.*. Low-temperature sintering of Ag composite pastes with different MOD additions. Materials. 2023, 16, 2340.

7. Chen Z., Yang F., Liu S., Hu X., Liu C., Zhou Z., Wang Z., Robertson S., Liu L.*Creep behavior of intermetallic compounds at elevated temperatures and its effect on fatigue life evaluation of Cu pillar bumps. Intermetallics. 2022, 144, 107526.

8. Chen Z., Xu G., Cao Q., Ruan M., Liu S., Pan H., Liu L.*Deformation measurement in Al thin films at elevated temperatures by digital image correlation with speckles prepared by femtosecond laser. Optics & Laser Technology. 2022, 155, 108339.

9. Liu L., Han D., Shi L., Luo Z., Shi R., Gao J., Shi Y., Cao X.*, Chen Z.* Fabrication and microwave absorbing property of WO3@WC with a core-shell porous structure. Ceramics International. 2022, 48(18), 26575-26584.

10. Liu L., Shi L., Peng J., Jiang B., Liu S., Liu C., Chen Z.*. Interfacial reaction between Sn-Ag solder and Electroless Ni-Fe-P diffusion barriers with different internal microstructure. Materials Research Bulletin. 2022, 152, 111854.

11. Chen Z., Xu G., Sun C., Liu L.*, Liu S., Ruan M. Warpage characterization of a large size panel subjected to inhomogeneous heating by a digital fringe projection system. Microelectronics Reliability. 2022, 139, 114818.

12. Tuo C., Yao Z., Liu W., Liu S., Liu L.,*Chen Z.,* Huang S., Cao X. Fabrication and characteristics of Cu@Ag composite solder preform by electromagnetic compaction for power electronics. Journal of Materials Processing Technology. 2021, 292, 117056.

13. Liu X, Liu L.*, Sun R., Li J.*. Low temperature sintering of MOD assisted Ag paste for die-attach application. Materials Letters. 2021, 305, 130799.

14. Chen Z., Zhang Z., Dong F., Liu S.*,Liu L.*, A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages, Journal of Electronic Packaging, 2021, 143, 011001.

15. Chen Z., Ma K., Liu L.*, Lee N-C., Liu G., Yan J., Li H., Liu S.*, Ruan M., Pan H., Lu W. Mechanical Performance and Reliability of Sn-Ag-Cu-Sb Alloy at Elevated Temperatures. IEEE Transactions on Component, Packaging and Manufacturing Technology. 2021, 11(7), 1081-1087.

发明专利：

1. 刘俐，罗州, 陈静怡, 田金章, 陈志文, 石妍, 曹学强. 莫来石-二氧化钛陶瓷基复合涂料、方法、应用、涂层制备方法. 专利号: ZL202211234643.3.

2. 刘俐, 石林, 罗州, 陈志文, 赵维纬, 曹学强, 蒋佳宁, 邓龙辉, 董淑娟. 一种由三氧化钨和碳化钨组成的核壳空心结构的吸波材料、制备方法及其应用. 专利号：ZL20211130981.5.

3. 刘俐，江棒，章桥新，曹学强，彭娟，庹城炯，刘生发. 一种锌铝基焊料用助焊剂及其制备方法. 专利号: ZL201910711656.7.